Your Partner for Wire Bonding Industry Resources
Finding reliable suppliers and partners in wire bonding takes years to learn.
Sunshine Semiconductor maintains a curated network of wire bonding industry resources and semiconductor equipment contacts built through 45+ years of hands-on field experience. Customers rely on SunSemi for practical guidance in supporting their wire bonding operations, including help identifying the right suppliers, service providers, and industry organizations.
Semiconductor Equipment Contacts
Finding dependable semiconductor equipment contacts for bonding wire, capillaries, wedge tools, and dicing blades is not always straightforward, particularly for engineers working with legacy equipment and processes. Sunshine Semiconductor has developed trusted relationships with suppliers across the wire bonding industry and makes those connections available to our customers as a practical reference resource.
The contacts and suppliers listed here have been evaluated through direct field experience over decades of wire bonding service and application work. We share them because we believe access to reliable industry resources makes every customer’s operation stronger and more resilient over time.
SunSemi works with customers across the wire bonding industry and often helps identify practical sources for equipment, tooling, consumables, test substrates, and process support. The organizations below are provided as useful industry resources.
Wire Bond Equipment
Rebuilt and supported manual wire bonding equipment, installation, training, preventive maintenance, troubleshooting, and process support.
MPP
Manual and semi-automatic wire bonders, wedge tools, and factory support.
Legacy wire bonding equipment manufacturer. Manual and semi-automatic product lines transitioned to MPP.
Bonding Wire
U.S. source for TANAKA bonding wire products.
The Bonding Source
Quick-turn supplier for bonding wire, tools, capillaries, wedges, and related consumables.
Bonding wire manufacturer serving semiconductor and microelectronics applications.
Manufacturer of bonding wire, ribbon, and precision microelectronic materials.
Precision fine wire manufacturer for microelectronics and specialty applications.
PICO Corporation
Supplier of precision bonding wire and specialty wire products.
Bonding Tools, Wedges & Capillaries
MPP
Source for wedge bonding tools used with MPP equipment platforms.
Source for bonding capillaries and related tooling.
DeWeyl Tool Company
Manufacturer of precision wire bonding tools, wedges, capillaries, and specialty tooling.
Supplier of wire bonding wedges, capillaries, and custom tooling.
Manufacturer of capillaries, wedges, and wire bonding consumables.
Supplier of wire bonding tools, capillaries, wedges, and related consumables.
The Bonding Source
Stocking supplier for emergency and quick-turn wire bonding tools and consumables.
Test Coupons & Qualification Substrates
Supplier of test coupons and qualification substrates used for wire bonder setup, process validation, operator training, and pull-test verification.
Pull Test Equipment
Bond testing and inspection equipment for microelectronics applications.
Bond testers and materials testing systems used in semiconductor and microelectronics assembly.
Microscopes & Inspection
Microscopes and inspection systems used in laboratory and production environments.
Microscope and optical inspection systems for precision manufacturing and research.
Microscope and inspection equipment for industrial and research applications.
Global industry association for semiconductor and microelectronics manufacturing.
Technical society focused on electronics packaging, interconnects, and related technologies.
Supplier Notice
These organizations are listed as industry resources only. SunSemi is an independent service organization and does not represent these companies unless specifically stated. Customers should evaluate suppliers based on their own equipment, application, availability, and purchasing requirements.
