K&S 4522 Multi-Process Ball Bonder

A proven manual ball bonder, rebuilt and fully supported by SunSemi.

The Model 4522 Multi-Process Ball Bonder for gold wire is especially designed for R&D and small production lots where unique processes are used. Supports standard Ball Bonding, Single Point TAB, Ball Bumping, and Coining, with Semi-auto and manual operation modes, individual bond parameter control, and a wide range of wire diameters.

Representative Photos

Bond head, microscope, and work area

Tool / workholder / application-area close-up

Left bond-parameter control panel

Right control panel / temperature / EFO area

K&S 4522

The K&S 4522 is a manual ball bonder designed for gold wire bonding in hybrid microelectronics, defense, aerospace, research, and manufacturing applications.

Every machine is rebuilt by Sunshine Semiconductor to deliver stable, reliable performance, including a refurbished warranty. Optional installation, setup, and operator training are available to help ensure long-term productivity.

Backed by decades of K&S experience, Sunshine Semiconductor also provides preventive maintenance, field service, and ongoing technical support, giving customers dependable service throughout the machine’s lifecycle.

Download the official K&S 4522 Manufacturer Brochure

Request Current Rebuild Pricing and Availability

Refurbished and Supported Manual Wire Bonders

Every refurbished manual wire bonder we sell is a complete working system, not just a machine that powers on.

Sunshine Semiconductor applies 45+ years of wire bonder support experience to every machine sale. Machine packages include refurbished warranty and are supported with options of installation, setup, and operator training. We maintain a robust inventory of legacy parts to keep your wire bonding operation running smoothly, without hunting for hard-to-find sources.

Not sure what you need? Contact SunSemi to discuss your application, and we will help you identify the right machine for your operation.

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Sunshine Semiconductor, Inc.

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