Legacy Kulicke & Soffa Products
At Sunshine Semiconductor, after expertly servicing and rebuilding legacy Kulicke & Soffa machines, we offer the like-new and fully functioning equipment for sale, in addition to also providing needed training.
Kulicke & Soffa Equipment For Sale:
K&S Model – 4526Independent Manual Z-axis control, separate from X and Y axis control.Independently adjustable Wire ParametersSeparate Force control for each bond, adjustable and independent per channel.Separate Bond Time control for each bond.Separate Bond Power control for each bond.No springs are used to apply bond force; digitally controlled components are utilized.Standard bonding, Deep Access and Ribbon bonding with same Bond Head “tool assembly”.No need to change “tool assembly”.Motorized Wire Clamp Motion with Linear Stepper Motor.Auto-Stepback Mode is included, with a motorized Y stage.Stitch Mode is included.No vacuum or air pressure is required for operation.Standard Reset Height is .260” with full range fine Z Motion control.High Reset Height is .500” for tall package clearance.Wire Sizes are from .0007” dia., to .003” dia. (18 – 75 Micron Diameter) Aluminum and Gold.Ribbon Sizes are up to .001” x .010” (gold).
K&S Model – 980
Like New 8″ wafer saw complete with integrated cleaner
K&S Model – 4123
Universal Wedge Bonder. An aluminum or gold wire bonder versatile enough to bond simple ICs and discrete devices or complex hybrids w/height variations up to 200 mils. Wire diameter range: Gold, 0.5 to 3.0 mil. Aluminum, 1.0 to 3.0 mil. Spool size: TC-1 0.5”. Requires 120V, 60 Hz.
K&S Model – 4124
Ball Bonder. The Model 4124 is a gold wire ball bonder that is versatile enough to bond simple ICs and discrete devices, or complex hybrids with height variations up to 300 mils. Extremely accurate loop and force control. Built-in electronic flame-off with ball size adjusting dial. Electronically controlled loop height dial on front panel. Electronically controlled tail length. Wire dia. range: Gold 0.7 to 3.0 mil. Bond Force:20 to 160 grams Bond Time: 10 to 100ms.
K&S Model – 4524
K&S Model – 4523 A Digital
Wedge Bonder Standard access and deep access in one machine. Digital Option, Auto stepback option installed, can be upgraded to vertical access with little expense. call for more details
K&S Model – 4524 AD Ball Bonder
K&S Model – 1419 DAWN II Automatic Ball Bonder
Ball Bonder. Wire Sizes: 1.0 to 20 mil. Max. wires per bonding program: IC – 70 wires hybrid – 600 wires or 2,500 wires software dependent 2” Spool dia. Very Good Condition.
K&S Model – 1470 Automatic Wedge Bonder
Wedge Bonder Series B Automatic Heavy Wire Bonder. B&L Stereozoom #4 microscope.Model 4430 Floppy Disk System.Aluminum wire: size range: 1.0 to 2.0 mils. Programmable bonding parameters: Bond force: 25 to 125 grams; Bond time: 1 to 999 ms. .X-Y table: Bonding area: 3 5/8″ x 4″.
K&S 1474vfp Automatic Wedge Bonder
K&S 1478 Large Area Automatic Wedge Bonder
K&S 8028pps Automatic Ball Bonder
K&S 1484 Turbo Automatic Ball Bonder
K&S 1488 Plus Automatic Ball Bonder
K&S 6495/6/7 Semiautomatic Die Attach
K&S 648 Eutectic Die Attach
K&S 642 Eutectic Die Attach
ASM Eagle 60 Copper Automatic Ball Bonder
Disco DFM-150 6” Wafer Tape Mounter
Bausch and Lomb StereoZoom 4 and 7 with various stands
To learn more about any one of our products that we have for sale, we invite you to contact us via our web form or by calling 407-696-8827 today.